Electronic package and method for fabricating the same

ABSTRACT

An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

BACKGROUND 1. Technical Field

The present disclosure relates to packaging technologies, and, moreparticularly, to a semiconductor package immune from electromagneticinterference and a method for fabricating the same.

2. Description of Related Art

Along with the progress of semiconductor technologies, various packagetypes have been developed for semiconductor devices. To improveelectrical performance, a lot of semiconductor products are providedwith a shielding function so as to prevent electromagnetic interference(EMI) from occurrence.

FIG. 1 is a schematic cross-sectional view of a conventional RF module 1having an EMI shielding function. Referring to FIG. 1, a plurality ofelectronic components 11 such as RF and non-RF chips are disposed on andelectrically connected to a substrate 10, and an encapsulant layer 13made of an epoxy resin is formed on the substrate 10 and encapsulatesthe electronic components 11. Further, a metal layer 15 is formed on anupper surface 13 a and a side surface 13 c of the encapsulant layer 13and a side surface 10 c of the substrate 10 by sputtering. The metallayer 15 is electrically connected to a grounding structure 100 on theside surface 10 c of the substrate 10 so as to be further electricallyconnected to a system ground, thus protecting the electronic components11 from being adversely affected by external EMI.

In addition, a plurality of conductive pads 101 are generally formed ona lower surface of the substrate 10 for mounting balls. Since theconductive pads 101 positioned around an outer periphery of the lowersurface of the substrate 10 is very close to edges of the substrate 10,during the sputtering process, the metal layer 15 easily overflows tothe lower surface of the substrate 10 and comes into contact with theconductive pads 101, thus resulting in a short circuit.

Therefore, there is a need to provide an electronic package and a methodfor fabricating the same so as to overcome the above-describeddrawbacks.

SUMMARY

In view of the above-described drawbacks, the present disclosureprovides an electronic package, which comprises: a substrate having afirst side, a second side opposite to the first side, and a lateral sideadjacent to the first side and the second side; an electronic componentdisposed on the first side of the substrate and electrically connectedto the substrate; an encapsulant layer formed on the first side of thesubstrate, encapsulating the electronic component, and having a firstsurface bonded to the first side of the substrate, a second surfaceopposite to the first surface, and a side surface adjacent to the firstsurface and the second surface; and a shielding layer formed on thesecond surface of the encapsulant layer and having an extending portionextending from a portion of an edge of the second surface of theencapsulant layer to the lateral side of the substrate along the sidesurface of the encapsulant layer, the extending portion being free fromextending to the second side of the substrate, with a portion of theside surface of the encapsulant layer and a portion of the lateral sideof the substrate exposed from the shielding layer.

The present disclosure further provides a method for fabricating anelectronic package, which comprises: providing a substrate has a firstside, a second side opposite to the first side, and a lateral sideadjacent to the first side and the second side; disposing at least oneelectronic component on the first side of the substrate, andelectrically connecting the electronic component to the substrate;forming on the substrate an encapsulant layer encapsulating theelectronic component and having a first surface bonded to the first sideof the substrate, a second surface opposite to the first surface, and aside surface adjacent to the first surface and the second surface; andforming on the second surface of the encapsulant layer a shielding layerhaving an extending portion extending from a portion of an edge of thesecond surface of the encapsulant layer to the lateral side of thesubstrate along the side surface of the encapsulant layer, the extendingportion being free from extending to the second side of the substrate,with a portion of the side surface of the encapsulant layer and aportion of the lateral side of the substrate exposed from the shieldinglayer.

In an embodiment, the shielding layer is formed by: providing a carrierhaving a plurality of substrates and a plurality of isolating portionsformed between the substrates; disposing a plurality of electroniccomponents on the substrates, with the encapsulant layer encapsulatingthe electronic components; forming in the encapsulant layer a pluralityof through holes extending to the lateral sides of the substrates andcorresponding in position to the isolating portions at corners of thesubstrates; forming the shielding layer on the second surface of theencapsulant layer, with the shielding layer extending into the throughholes to form the extending portions; and performing a singulationprocess along the isolating portions to separate the substrates from oneanother.

In an embodiment, the substrate has a plurality of conductive padsexposed from the second side of the substrate.

In an embodiment, the substrate has a grounding portion in contact withthe shielding layer. In another embodiment, the grounding portioncommunicates with the lateral side of the substrate and is in contactwith the extending portion of the shielding layer.

In an embodiment, the encapsulant layer is made of an insulatingmaterial.

In an embodiment, the shielding layer is made of a conductive material.

In an embodiment, the extending portion extends from a corner of thesecond surface of the encapsulant layer toward a corner of the secondside of the substrate.

According to the present disclosure, the extending portion of theshielding layer extends from a portion of an edge of the second surfaceof the encapsulant layer to the lateral side of the substrate along theside surface of the encapsulant layer, the extending portion being freefrom extending to the second side of the substrate, with a portion ofthe side surface of the encapsulant layer and a portion of the lateralside of the substrate exposed from the shielding layer. As such, thepresent disclosure prevents the extending portion from coming intocontact with the conductive pads of the substrate, thereby effectivelyavoiding a short circuit from occurrence.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic cross-sectional view of a conventional RF module;

FIGS. 2A to 2D are schematic cross-sectional views showing a method forfabricating an electronic package according to the present disclosure;

FIGS. 2A′ and 2B′ are schematic upper views of FIGS. 2A and 2B,respectively; and

FIG. 2D′ is a schematic enlarged perspective view of FIG. 2D.

DETAILED DESCRIPTION OF EMBODIMENTS

The following illustrative embodiments are provided to illustrate thepresent disclosure; these and other advantages and effects can beapparent to those in the art after reading this specification.

It should be noted that all the drawings are not intended to limit thepresent disclosure. Various modifications and variations can be madewithout departing from the spirit of the present disclosure. Further,terms such as “first”, “second”, “upper”, “lower”, “a” etc. are merelyfor illustrative purposes and should not be construed to limit the scopeof the present disclosure.

FIGS. 2A to 2D are schematic cross-sectional views showing a method forfabricating an electronic package 2 according to the present disclosure.

Referring to FIG. 2A, a carrier 20 having a first side 20 a and a secondside 20 b opposite to the first side 20 a is provided, and a pluralityof electronic components 21 are disposed on the first side 20 a of thecarrier 20. Then, an encapsulant layer 22 is formed on the first side 20a of the carrier 20 to encapsulate the electronic components 21.

In an embodiment, referring to FIG. 2A′, the carrier 20 is of afull-panel type, which has a plurality of substrates 20′ arranged in anarray and a plurality of isolating portions 20″ formed between thesubstrates 20′. In an embodiment, each of the substrates 20′ is acircuit structure having a core layer or a coreless circuit structure,which has a plurality of circuit layers 200 such as fan-outredistribution layers. The substrate 20′ is made of a dielectricmaterial, such as polybenzoxazole (PB 0), polyimide or prepreg.Alternatively, the substrate 20′ can be, for example, an organic board,a wafer, or a board with metal wiring.

The circuit layers 200 have a plurality of grounding portions 202defined therein and a plurality of conductive pads 201 formed on thesecond side 20 b of the substrate 20.

Any desired number of electronic components 21 can be disposed on thesubstrate 20′. Each of the electronic components 21 can be an activeelement such as a semiconductor chip, a passive element, such as aresistor, a capacitor or an inductor, or a combination thereof. In anembodiment, the electronic component 21 is an RF chip, such as aBluetooth chip, a Wi-Fi chip or the like. In an embodiment, theelectronic component 21 has a plurality of electrode pads (not shown)electrically connected to the circuit layers 200 through a plurality ofbonding wires 210. In another embodiment, the electronic component 21 isdisposed on the carrier 20 in a flip-chip manner and the electrode padsof the electronic component 21 are electrically connected to the circuitlayers 200 through a plurality of conductive bumps 210′ made of, forexample, a solder material. In a further embodiment, the electroniccomponent 21 is directly bonded and electrically connected to thecircuit layers 200.

The encapsulant layer 22 has a first surface 22 a bonded to the firstside 20 a of the carrier 20 and a second surface 22 b opposite to thefirst surface 22 a. In an embodiment, the encapsulant layer 22 is madeof an insulating material, such as polyimide, a dry film, an epoxy resinor a molding compound. The encapsulant layer 22 can be formed on thefirst side 20 a of the carrier 20 by lamination or molding.

Referring to FIG. 2B, a plurality of through holes 230 are formed in theencapsulant layer 22, and extend to the second side 20 b of the carrier20.

In an embodiment, referring to FIG. 2A′, the through holes 230 areformed at intersections A of the isolating portions 20″. As such,referring to FIG. 2B′, the through holes 230 are positioned at cornersof the substrates 20′ and have cross-shaped end surfaces 230 a.

Referring to FIG. 2C, a metal electroplating process is performed toform a shielding layer 23 on the second surface 22 b of the encapsulantlayer 22. The shielding layer 23 extends into the through holes 230 toserve as extending portions 23 a. The extending portions 23 a are incontact and electrical connection with the grounding portions 202 of thecarrier 20 so as to serve as electromagnetic shields.

In an embodiment, the shielding layer 23 is made of Au, Ag, Cu, Ni, Fe,Al, or stainless steel (SUS).

The shielding layer 23 can be formed by coating, sputtering, chemicalplating, electroless plating or evaporation.

It should be noted that the grounding portions 202 can be formed at anydesired position as long as the shielding layer 23 is electricallyconnected to the grounding portions 202.

Referring to FIGS. 2D and 2D′, a singulation process is performed alongcutting paths S of FIG. 2C so as to obtain electronic packages 2. Thecutting paths S correspond in position to the isolating portions 20″ andpass through the through holes 230. The extending portion 23 a extendsfrom a portion of edges (for example, corners) of the second surface 22b of the encapsulant layer 22 to the lateral side 20 c of the substrate20′ along the side surface 22 c of the encapsulant layer 22, withoutextending to the second side 20 b of the substrate 20′, with a portionof the side surface 22 c of the encapsulant layer 22 and a portion ofthe lateral side 20 c of the substrate 20′ exposed from the shieldinglayer 23.

In an embodiment, the lateral side 20 c of the substrate 20′ is adjacentto the first side 20 a and the second side 20 b, and the side surface 22c of the encapsulant layer 22 is adjacent to the first surface 22 a andthe second surface 22 b.

Further, the grounding portion 202 communicates with the lateral side 20c of the substrate 20′ so as to be in contact with the extending portion23 a, and the conductive pads 201 are exposed from the second side 20 bof the substrate 20′.

In an embodiment, the extending portion 23 a extends from a corner ofthe second surface 22 b of the encapsulant layer 22 toward a corner ofthe second side 20 b of the substrate 20′. The extending portion 23 adoes not extend to the second side 20 b of the substrate 20′. Instead,the extending portion 23 a only extends to the intersection of thelateral side 20 c and the second side 20 b of the substrate 20′.

In addition, in subsequent processes, a plurality of conductive elements(not shown) such as solder balls are disposed on the conductive pads 201for an external device (not shown), such as a package structure or acircuit board to be mounted thereon.

According to the present disclosure, during the formation of theshielding layer 23, the through holes 230 allow the extending portions23 a of the shielding layer 23 to extend from a corner of the secondsurface 22 b of the encapsulant layer 22 toward a corner of the secondside 20 b of the substrate 20′. In an embodiment, the extending portion23 a only extends to the intersection of the lateral side 20 c and thesecond side 20 b of the substrate 20′, without extending to the secondside 20 b of the substrate 20′. As such, the present disclosure preventsthe extending portion 23 a from overflowing on the second side 20 b ofthe substrate 20′ and coming into contact with the conductive pads 201,thus effectively avoiding a short circuit from occurrence.

Further, the shielding layer 23 that covers an outer periphery of theelectronic component 21 protects the electronic component 21 againstexternal EMI during operation of the electronic package 2, therebyimproving electrical performance of the electronic package 2.

The present disclosure further provides an electronic package 2, whichhas: a substrate 20′ having a first side 20 a, a second side 20 bopposite to the first side 20 a, and a lateral side 20 c adjacent to thefirst side 20 a and the second side 20 b; at least one electroniccomponent 21 disposed on the first side 20 a of the substrate 20′ andelectrically connected to the substrate 20′; an encapsulant layer 22formed on the first side 20 a of the substrate 20′, encapsulating theelectronic component 21, and having a first surface 22 a bonded to thefirst surface 20 a of the substrate 20′, a second surface 22 b oppositeto the first surface 22 a, and a side surface 22 c adjacent to the firstsurface 22 a and the second surface 22 b; and a shielding layer 23formed on the second surface 22 b of the encapsulant layer 22 and havingan extending portion 23 a extending from a portion of an edge of thesecond surface 22 b of the encapsulant layer 22 to the lateral side 20 cof the substrate 20′ along the side surface 22 c of the encapsulantlayer 22, without extending to the second side 20 b of the substrate 20,with a portion of the side surface 22 c of the encapsulant layer 22 anda portion of the lateral side 20 c of the substrate 20′ exposed from theshielding layer.

In an embodiment, the substrate 20′ has a plurality of conductive pads201 exposed from the second side 20 b of the substrate 20′.

In an embodiment, the substrate 20′ has a grounding portion 202 incontact with the shielding layer 23. In another embodiment, thegrounding portion 202 communicates with the lateral side 20 c of thesubstrate 20′ so as to be in contact with the extending portion 23 a ofthe shielding layer 23.

In an embodiment, the encapsulant layer 22 is made of an insulatingmaterial.

In an embodiment, the shielding layer 23 is made of a conductivematerial.

In an embodiment, the extending portion 23 a extends from a corner ofthe second surface 22 b of the encapsulant layer 22 toward a corner ofthe second side 20 b of the substrate 20′.

According to the present disclosure, the extending portion of theshielding layer extends from a portion of an edge of the second surfaceof the encapsulant layer to the lateral side of the substrate along theside surface of the encapsulant layer, without extending to the secondside of the substrate, with a portion of the side surface of theencapsulant layer and a portion of the lateral side of the substrateexposed form the shielding layer. As such, the present disclosureprevents the extending portion from coming into contact with theconductive pads of the substrate, thus effectively avoiding a shortcircuit from occurrence.

The above-described descriptions of the detailed embodiments are only toillustrate the preferred implementation according to the presentdisclosure, and it is not to limit the scope of the present disclosure.Accordingly, all modifications and variations completed by those withordinary skill in the art should fall within the scope of presentdisclosure defined by the appended claims.

What is claimed is:
 1. An electronic package, comprising: a substrate having a first side, a second side opposite to the first side, and a lateral side adjacent to the first side and the second side; an electronic component disposed on the first side of the substrate and electrically connected to the substrate; an encapsulant layer having a first surface bonded to the first side of the substrate, a second surface opposite to the first surface, and a side surface adjacent to the first surface and the second surface, with the encapsulant layer formed on the first side of the substrate and encapsulating the electronic component; and a shielding layer formed on the second surface of the encapsulant layer and having an extending portion extending from a portion of an edge of the second surface of the encapsulant layer to the lateral side of the substrate along the side surface of the encapsulant layer, the extending portion being free from extending to the second side of the substrate, with a portion of the side surface of the encapsulant layer and a portion of the lateral side of the substrate exposed from the shielding layer.
 2. The electronic package of claim 1, wherein the substrate has a plurality of conductive pads exposed from the second side of the substrate.
 3. The electronic package of claim 1, wherein the substrate has a grounding portion in contact with the shielding layer.
 4. The electronic package of claim 3, wherein the grounding portion communicates with the lateral side of the substrate and is in contact with the extending portion of the shielding layer.
 5. The electronic package of claim 1, wherein the encapsulant layer is made of an insulating material.
 6. The electronic package of claim 1, wherein the shielding layer is made of a conductive material.
 7. The electronic package of claim 1, wherein the extending portion extends from a corner of the second surface of the encapsulant layer toward a corner of the second side of the substrate.
 8. A method for fabricating an electronic package, comprising: providing a substrate having a first side, a second side opposite to the first side, and a lateral side adjacent to the first side and the second side; disposing an electronic component on the first side of the substrate, and electrically connecting the electronic component to the substrate; forming on the substrate an encapsulant layer encapsulating the electronic component and having a first surface bonded to the first side of the substrate, a second surface opposite to the first surface, and a side surface adjacent to the first surface and the second surface; and forming on the second surface of the encapsulant layer a shielding layer having an extending portion extending from a portion of an edge of the second surface of the encapsulant layer to the lateral side of the substrate along the side surface of the encapsulant layer, the extending portion being free from extending to the second side of the substrate, with a portion of the side surface of the encapsulant layer and a portion of the lateral side of the substrate exposed from the shielding layer.
 9. The method of claim 8, wherein the substrate has a plurality of conductive pads exposed from the second side of the substrate.
 10. The method of claim 8, wherein the substrate has a grounding portion in contact with the shielding layer.
 11. The method of claim 10, wherein the grounding portion communicates with the lateral side of the substrate and is in contact with the extending portion of the shielding layer.
 12. The method of claim 8, wherein the encapsulant layer is made of an insulating material.
 13. The method of claim 8, wherein the shielding layer is made of a conductive material.
 14. The method of claim 8, wherein the extending portion extends from a corner of the second surface of the encapsulant layer toward a corner of the second side of the substrate.
 15. A method of forming the shielding layer according to claim 8, comprising: providing a carrier having a plurality of substrates and a plurality of isolating portions formed between the substrates; disposing a plurality of electronic components on the substrates, with an encapsulant layer encapsulating the electronic components, the encapsulant layer having a first surface bonded to the first side of the substrate, a second surface opposite to the first surface, and a side surface adjacent to the first surface and the second surface; forming in the encapsulant layer a plurality of through holes extending to lateral surfaces of the substrates and corresponding in position to the isolating portions at corners of the substrates; forming the shielding layer on the second surface of the encapsulant layer, with the shielding layer extending in the through holes to form extending portions; and performing a singulation process along the isolating portions to separate the substrates from one another. 